Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors
S. Abadal, R. Guirado, H. Taghvaee, A. Jain, E. Pereira de Santana, P. Haring Bolívar, M. Saeed, R. Negra, Z. Wang, K-T. Wang, M. C. Lemme, J. Klein, M. Zapater, A. Levisse, D. Atienza, D. Rossi, F. Conti, M. Dazzi, G. Karunaratne, I. Boybat and A. Sebastian
IEEE Wireless Communications Magazine, 2023
